Yplasma zaps the air to cool chips for data centers

In a remarkable demonstration that could easily be mistaken for magic, David Garcia showcased a groundbreaking technology developed by his company, Yplasma. During a recent presentation, a simple setup featured five candles placed before a harmonica-shaped device adorned with wires. As if by enchantment, the flames flickered and extinguished, revealing the underlying science. Inside the device, two copper strips energized with electrical current generate plasma—clouds of charged particles that create airflow through the device and across the candles. While traditional fans accomplish similar tasks, Yplasma’s actuator stands out as it contains no moving parts, making it both thin and flexible. "It’s cost-effective to produce, easily fits into tight spaces, and consumes minimal energy," Garcia explained. For instance, while a typical laptop fan may draw 3 to 4 watts, Yplasma's actuator operates on just 1 watt to achieve comparable cooling efficiency. These innovative features have attracted the interest of a prominent semiconductor manufacturer. Recently, Yplasma secured a $2.5 million seed funding round led by Faber, with additional participation from SOSV. As part of this collaboration, the company will conduct its research and development at SOSV’s Hax lab in Newark, New Jersey, as well as maintain offices in Madrid. Yplasma originated from Spain's space agency, INTA, and now aims to harness the power of electrical forces for various applications. The potential uses for this air manipulation technology are extensive, ranging from vehicle aerodynamics and satellite propulsion to aircraft deicing and water harvesting. Initially targeting the wind turbine market, Yplasma's technology can enhance electricity generation by 10% to 15% by optimizing airflow and reducing drag. Additionally, these plasma actuators can be adapted to produce heat, aiding in the de-icing of turbine blades, a crucial factor in North America where ice accumulation can lead to significant energy loss. Yplasma is actively developing a product for wind turbines and plans to conduct a test at Sandia National Laboratory this summer. However, following a successful collaboration with the semiconductor manufacturer, the company has shifted its focus toward cooling solutions for chips. With cooling representing one of the largest non-compute expenses in data centers, enhancing the efficiency of these systems is vital for increasing profitability. "There's a significant gap between traditional fans and more expensive liquid or immersive cooling systems," Garcia noted. "Data centers are eagerly seeking effective cooling solutions."