
India is poised to make a significant impact in the global semiconductor landscape, thanks to insights from NITI Aayog, the country’s premier policy think tank. A recent report emphasizes the potential of two-dimensional (2D) materials as a game-changer in the semiconductor sector, positioning India to lead in post-silicon technologies. The integration of semiconductor policies with 2D materials research is seen as a pathway to significant technological advancements. This combination could empower India to establish itself as a key player in the global semiconductor shift. According to NITI Aayog, the exploration of 2D materials could offer comprehensive technological progress, providing India with the tools to disrupt the semiconductor race. 2D materials are characterized by their ultra-thin structure, often just a single atomic layer thick, which endows them with unique electronic, optical, and mechanical properties that set them apart from traditional three-dimensional materials. The report highlights innovative applications, such as smartphones that fold yet remain resilient, and displays that are so thin they appear to disappear. Moreover, the report cites examples of ultra-efficient CPUs and GPUs made from 2D materials, which operate more quickly and coolly, thereby drastically reducing energy consumption and extending battery life by days. These materials are essential for the future of semiconductors, memory systems, quantum devices, flexible electronics, and energy solutions. For instance, ultra-thin 2D transistors can operate at voltage thresholds below 0.3V, resulting in a significant reduction in power dissipation compared to existing technologies. Additionally, 2D-based synaptic devices in neuromorphic arrays can reduce chip area by over 40% without compromising performance. Despite the promising potential, the report cautions that India’s development of 2D materials technology is still in its infancy. Current research focuses primarily on the synthesis of these materials and basic device characterization. There is a pressing need for advancements in wafer-scale integration, heterostructure engineering, and the creation of deployable prototypes. The prospects of mono- to few-layer 2D materials could revolutionize computing, leading to substantial economic advantages by reducing power consumption, enabling energy-efficient AI applications, and facilitating new computing form factors. This evolution is particularly crucial for edge-AI, wearable technology, and quantum-class processors, where efficiency and compact design are paramount.
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